Method of producing an optoelectronic component, and optoelectronic component
US10991683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2018 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Mar 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an optoelectronic component includes: A) providing a substrate, B) providing a metallic liquid arranged in a structured manner and in direct mechanical contact on the substrate and including at least one first metal, C) providing semiconductor chips each having a metallic termination layer on their rear side, the metallic termination layer including at least one second metal different from the first metal, and D) self-organized arranging the semiconductor chips on the metallic liquid so that the first metal and the second metal form at least one intermetallic compound having a higher re-melting temperature than the melting temperature of the metallic liquid, wherein the intermetallic compound is a connecting layer between the substrate and the semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.