Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

US10991845B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Andreas Plößl · Regensburg, DE
• Siegfried Herrmann · Neukirchen, DE
• Martin Rudolf Behringer · Regensburg, DE
• Frank Singer · Regenstauf, DE
• Thomas Schwarz · Rhede, DE

Key dates

• Filing date: Mar 29, 2018
• Grant date: Apr 27, 2021
• Expiry date: Mar 29, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment the method include A) providing at least two source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chip; B) providing a target substrate having a mounting plane, the mounting plane being configured for mounting the semiconductor chip; and C) transferring at least part of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips, within one type, maintain their relative position with respect to one another, so that each type of semiconductor chips arranged on the target substrate has a different height above the mounting plane, wherein the semiconductor chips are at least one of at least partially stacked one above the other or at least partially applied to at least one casting layer.