Patent · US Active

Carrier for an optoelectronic component, method of producing a carrier for an optoelectronic component, wafer and soldering method

US10991853B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Christoph Walter · Stuttgart, DE
Roland Enzmann · Regensburg, DE
Markus Horn · Straubing, DE
Jan Seidenfaden · Neumarkt i.d.OPf., DE

Key dates

Filing date	Dec 14, 2016
Grant date	Apr 27, 2021
Priority date	—
Expiry date	Dec 14, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.