Thermal interface member and method of making the same
US10991998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2019 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | May 22, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal interface member may comprise a substrate having a first surface and an opposite second surface, an electrically conductive layer disposed on the first surface of the substrate, and an electrically resistive layer disposed on the first surface of the substrate. The substrate may comprise a compliant electrically insulating and thermally conductive material including a polymeric matrix phase and a dispersed phase of thermally conductive particles. The conductive layer may be patterned into a first electrode and a second electrode spaced apart from the first electrode on the first surface of the substrate. The resistive layer may be in electrical contact with the first and second electrodes of the conductive layer and may comprise a resistive material having a positive resistance temperature coefficient and a resistance that increases with an increase in temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.