Controlling AM spatter and conduction
US10994337B2 · kind B2 · utility
3Cited by
3References
4Claims
0Family size
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Key dates
| Filing date | Dec 12, 2018 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Jan 31, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An intelligent feed forward model to control additive manufacturing (AM) laser powder bed fusion process and reduce spattering whereby defects are eliminated by controlling the laser power and reducing spattering through a computer model. This application describes using a proportional integral derivative (PID) controller to create a power map that reduces spattering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.