Patent · US Active

Mold assembly for resin transfer molding

US10994504B2 · kind B2 · utility

2Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 18, 2017
Grant dateMay 4, 2021
Priority date
Expiry dateOct 19, 2039

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29D99/0025
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold assembly includes an injection mold configured to receive a woven preform. The preform has a principal direction with at least one edge extending substantially along the principal direction. The mold assembly is configured to allow the impregnation of the preform with a resin injected into the mold. The mold assembly further includes a removable longitudinal element for the injection mold, wherein said longitudinal element is configured to cooperate with the preform and conformed as a profiled member configured to be arranged in contact with the mold along at least the segment of the edge of the preform in order to prevent the pinching of free fibers extending from the edge of the preform between the two parts of the mold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.