Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system
US10994988B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Mar 5, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/096
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.