Resin composition and applications thereof
US10995189B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2017 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE02D2300/0004
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin composition contains an ethylene-vinyl alcohol copolymer (A) in which an ethylene unit content is from 10 to 60 mol %, a hindered amine-based compound (B) having a 2,2,6,6-tetraalkylpiperidine ring structure and having an alkoxy group bonded to a nitrogen atom in the structure, and a hindered phenol-based compound (C) having an ester bond or an amide bond. The resin composition contains 0.1 to 5 parts by mass of the hindered amine-based compound (B) and 0.2 to 5 parts by mass of the hindered phenol-based compound (C) with respect to 100 parts by mass of the ethylene-vinyl alcohol copolymer (A), and a mass ratio (C)/(B) is from 0.2 to 3.6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.