Electronic device comprising an electronic chip provided with an optical cable
US10996412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.