Identification and redesign of critical thin segments below 3D printer resolution
US10997796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/2021
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems and methods may support identification and redesign of critical thin segments in a 3D model that are below 3D printer resolution. Identification of critical thin segments may include segmenting cross-sectional slices of the 3D model into printable segments and non-printable segments and using a machine learning model trained using geometrical features computed on thin regions to classify the non-printable segments as critical or non-critical. Redesign of critical thin segments may include thickening the critical thin segments such that the segment size of the critical thin segments satisfy a thickening criterion with respect to the printer resolution and smoothing sharp corners added to the cross-sectional slice at an intersection between the critical thin segment and a neighboring printable segment. Redesign of the critical thin segments may account for tolerable overhang.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.