Substrate cleaning method, substrate cleaning apparatus, and method for fabricating a semiconductor device using the apparatus
US10998185B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 6, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Mar 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a method for cleaning a substrate, an apparatus for cleaning a substrate, and a method for fabricating a semiconductor device using the same. The method may include cleaning a substrate in a wet process, providing a supercritical fluid onto the substrate to remove moisture from the substrate, and cleaning the substrate in a dry process to remove defect particles from a substrate, which are produced by the supercritical fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.