Heat treatment method and heat treatment apparatus for managing heat treatment of dummy wafer
US10998207B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Oct 21, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Product recipes in which a treatment procedure and treatment conditions of heat treatment of product wafers are specified are created timely. Dummy recipes in which a treatment procedure and treatment conditions of heat treatment of dummy wafers are specified are also created. Each of the product recipes and a corresponding one of the dummy recipes are stored in association with each other. Dummy treatment of a dummy wafer starts when a controller receives an advance notice signal indicating that product wafers will arrive at a heat treatment apparatus. The dummy wafers are stored in a dummy carrier permanently installed on a load port exclusive to the dummy carrier. The dummy treatment is performed in accordance with a dummy recipe associated with a product recipe corresponding to the product wafers scheduled to arrive at the heat treatment apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.