Board with embedded passive component
US10998247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Jul 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/096
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.