Patent · US Active

Integration of microdevices into system substrate

US10998352B2 · kind B2 · utility

0Cited by
10References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 2019
Grant dateMay 4, 2021
Priority date—
Expiry dateAug 15, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/0364
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.