Combinatorial inner module
US10999669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Nov 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.