Patent · US Active

Method for applying electronic components

US10999936B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

LUMILEDS LLC · US

Inventors

Matthias Epmeier · Aachen, DE
Petra Wellmeier · Aachen, DE
Frank Giese · Aachen, DE
Carsten Weber · Aalen, DE
Michael Deckers · Jülich, DE
Georg Henninger · Aachen, DE

Key dates

Filing date	Sep 6, 2019
Grant date	May 4, 2021
Priority date	—
Expiry date	Sep 6, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.