Patent · US Active

Applicator

US11000877B2 · kind B2 · utility

0Cited by
19References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 13, 2018
Grant dateMay 11, 2021
Priority date
Expiry dateSep 13, 2038

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02T50/10
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An applicator for application onto and embossing microprofiling of a fluidic medium on a substrate, in particular in the aerospace sector, and a corresponding application device having such an applicator. The applicator has a circumferentially moving die that has an embossing profile, a press for the die and a stabilizing device, in particular a hardening device, for the applied medium. In addition, the applicator has a hollow support body, surrounded by the die at a distance forming a gap, the press being arranged in the gap. The application device has, in addition to the applicator, a handling device for a relative movement between the applicator and a workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.