Applicator
US11000877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2018 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Sep 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An applicator for application onto and embossing microprofiling of a fluidic medium on a substrate, in particular in the aerospace sector, and a corresponding application device having such an applicator. The applicator has a circumferentially moving die that has an embossing profile, a press for the die and a stabilizing device, in particular a hardening device, for the applied medium. In addition, the applicator has a hollow support body, surrounded by the die at a distance forming a gap, the press being arranged in the gap. The application device has, in addition to the applicator, a handling device for a relative movement between the applicator and a workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.