Methods for making high sound transmission class gypsum boards and gypsum boards made by the method
US11002010B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Mar 18, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/168
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A layered gypsum wallboard can include: a gypsum board having opposing front and back faces, wherein the gypsum board comprises a first cover sheet material at the front face, a second cover sheet material at the back face, and a gypsum core layer comprising gypsum; an adhesive layer on the second cover sheet material of the gypsum board, the adhesive including a polymer having a glass transition temperature (Tg) of −10° C. to 30° C.; an intermediate gypsum layer including gypsum on the adhesive layer such that the adhesive layer is between the second cover sheet material and the intermediate gypsum layer, wherein the adhesive layer and the intermediate gypsum layer have a combined thickness of 0.09 inches to 0.25 inches; and a third cover sheet material, wherein the intermediate gypsum layer is between and in contact with the adhesive layer and the third cover sheet material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.