Apparatus for high-throughput sequential tensile testing and methods thereof
US11002649B1 · kind B1 · utility
1Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Jul 9, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Feb 5, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates, in part, to an apparatus configured to test a plurality of test samples within a sample cartridge. Such an apparatus can facilitate high-throughput tensile testing of such test samples. Also described herein are methods for using such an apparatus and for testing such test samples.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.