Bond test apparatus and method
US11002662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2018 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bond test apparatus comprises a test tool assembly 200 comprising a test tool 40 configured to contact a bond during a bond test, a flexure 80 coupled to the test tool assembly, and a sensor. The sensor is configured to provide a measurement of a displacement of a first end of the flexure 80 relative to a second end of the flexure on application of a force to the flexure, and a processor is configured to receive a displacement signal from the sensor and, based on the displacement signal and optionally a known stiffness of the flexure, to determine the force on the flexure. A cartridge for a bond test apparatus, a method of measuring a force in a bond test apparatus, and a method of measuring the closing force on the jaws of a bond test tool are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.