High-sensitivity, low thermal deflection, stress-matched atomic force microscopy and scanning thermal microscopy probes
US11002759B2 · kind B2 · utility
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Key dates
| Filing date | Sep 10, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Sep 10, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01Q70/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A scanning probe microscope includes a cantilever structure; and a metallization layer on the cantilever structure. The cantilever structure and the metallization layer expand and contract at equivalent rates upon thermal loading. The cantilever structure and the metallization layer may include matching coefficient of thermal expansion levels. The cantilever structure may include SiN. The metallization layer may include 50 nm of Ti. The metallization layer may include 50 nm of Cr. The metallization layer may include 5 nm of Ti and 45 nm of Ge. The cantilever structure may include no thermally-induced deflections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.