Substrate processing apparatus and method
US11004707B1 · kind B1 · utility
2Cited by
18References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2020 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jan 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus including an inner chamber formed by an upper portion and a lower portion, a substrate support to support a substrate within the upper portion of the inner chamber, a plasma system to provide the inner chamber with plasma species from the top side of the inner chamber, and an outer chamber surrounding the upper portion of the inner chamber. The lower portion of the inner chamber extends to the outside of the outer chamber and remains uncovered by the outer chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.