Light-emitting device and manufacturing method thereof

US11005007B2 · kind B2 · utility

Assignee

• Epistar Corporation · TW

Inventors

• Wen-Luh Liao · Hsinchu, TW
• Chih-Chiang Lu · New Taipei, TW
• Shih-Chang Lee
• Hung-Ta Cheng · Hsinchu, TW
• Hsin-Chan CHUNG · Hsinchu, TW
• Yi-Chieh Lin · Hsinchu, TW

Key dates

• Filing date: Sep 12, 2019
• Grant date: May 11, 2021
• Expiry date: Sep 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.