Spatial power-combining devices with thin film resistors
US11005437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Mar 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/67
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Spatial power-combining devices and, more particularly, spatial power-combining devices with improved isolation are disclosed. Spatial power-combining devices are disclosed that include a thin film resistor that is configured to provide improved signal isolation. The thin film resistor may be arranged within one or more amplifier assemblies of the spatial power-combining device to reduce signal leakage between the amplifier assemblies. The thin film resistor may be formed on a carrier substrate or the thin film resistor may supported by a surface of an amplifier assembly without a carrier substrate. Spatial power-combining devices are disclosed that include a radial arrangement of amplifier assemblies, and each amplifier assembly includes an antenna structure and a thin film resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.