Acoustic wave device, radio-frequency front end circuit, and communication device
US11005444B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/40
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic wave device includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, a support provided on the piezoelectric substrate so as to surround the IDT electrode, and a cover provided on the support. The support has a larger thermal expansion coefficient than the piezoelectric substrate. The IDT electrode is provided in a hollow space that is surrounded by the piezoelectric substrate, the support, and the cover. The support includes an inner surface on a side of the hollow space, and an outer surface on a side opposite to the inner surface, and the support includes a recess provided in at least one of the inner and outer surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.