Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies
US11006549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | May 1, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.