Hot-melt adhesive resin film and production method thereof
US11007756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2016 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a hot-melt adhesive resin film which does not cause peeling between respective layers, has an excellent adhesive force, and has strong adherability even in severe durability evaluation, to various planar or film-like adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer comprise an acid-modified polyolefin resin, and a production method thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.