Laser processing
US11008250B2 · kind B2 · utility
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22References
10Claims
0Family size
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Inventor
Key dates
| Filing date | Jun 13, 2015 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Dec 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/53
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modification inside the transparent material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.