Cutting elements with impact resistant diamond body
US11008815B2 · kind B2 · utility
0Cited by
6References
16Claims
0Family size
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Key dates
| Filing date | Jul 20, 2016 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Mar 6, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/55
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.