Method and apparatus for mitigating adverse effects of bonding wire of external optical modulators
US11009763B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Aug 28, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/5051
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.