Integrated multi-provider compute platform
US11010194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Apr 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L41/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention includes embodiments of systems and methods for addressing the interdependencies that result from integrating the computing resources of multiple hardware and software providers. The integrated, multi-provider cloud-based platform of the present invention employs abstraction layers for communicating with and integrating the resources of multiple back-end hardware providers, multiple software providers and multiple license servers. These abstraction layers and associated functionality free users not only from having to implement and configure provider-specific protocols, but also from having to address interdependencies among selected hardware, software and license servers on a job-level basis or at other levels of granularity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.