Method for manufacturing resistor, and resistor
US11011290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2020 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Jun 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/281
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.