Method of manufacturing light-emitting device
US11011685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2020 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Feb 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8513
Abstract
A method of manufacturing a light-emitting device includes steps of: preparing at least one first member each including (i) a light-transmissive member having a top surface, a bottom surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a phosphor layer disposed below the bottom surface, and (iii) a cover layer disposed on a lateral surface of the phosphor layer and the lateral surface of the light-transmissive member; and, for each of the at least one first member, mounting a light-emitting element on a base having a fat plate shape, bonding the light-emitting element and the phosphor layer of the first member together, placing a frame body on the base so as to surround the light-emitting element, and filling a light-reflective member in the frame body so that the light-reflective member covers at least a portion of the cover layer of the first member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.