Cooling techniques to improve thermal performance of electroacoustic device
US11013101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2018 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A loudspeaker assembly comprises an enclosure having a first end and a second end, the first end including an opening; an acoustic driver at the second end of the enclosure; an acoustic volume between the first end and the second of the enclosure; a circuit board at the first end of the enclosure; a firebox covering the opening at the first end of the enclosure, the firebox providing a convection flow path in the acoustic volume over heat-generating components of the circuit board; and a heat sink extending from the circuit board in a direction away from the acoustic volume for providing a conduction flow path through the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.