Molded circuit substrates
US11013123B2 · kind B2 · utility
0Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Oct 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.