Electronic devices comprising butyl rubber
US11013133B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.