Decoupled conduction/convection dual heat sink for on-board memory microcontrollers
US11013141B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Jul 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.