Electronic component housing cooling system
US11013151B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Dec 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20736
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis includes a receiver frame for receiving a plurality of electronic components. The receiver frame includes a front end, a rear end, a top wall, and a bottom wall. The receiver frame also includes one or more apertures positioned in the bottom wall or the top wall at a location adjacent to the front end. The receiver frame also includes a plurality of air flow channels coupling openings in the front end to the one or more apertures such that air flow from the openings of the front end is first directed towards the rear end across the plurality of electronic components before being directed back towards the front end and then exiting the one or more apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.