EMI shielding film and method of manufacturing the same
US11013156B1 · kind B1 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2020 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 15, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An EMI shielding film includes a flexible composite metal layer, a transparent insulating layer, and a conductive adhesive layer. The conductive adhesive layer is formed by removing a solvent from a conductive adhesive composition. The conductive adhesive composition includes an acrylate solution, a divalent acid ester solution, a plurality of conductive particles, and the solvent. The present disclosure further includes a method of manufacturing the EMI shielding film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.