Packaging material, and process of manufacturing the same
US11014725B2 · kind B2 · utility
0Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2017 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Sep 16, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2231/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to a packaging material comprising a core material layer having an area radially extending from an edge of a hole in said core material layer, wherein said area has a linearly or non-linearly decreasing core material layer thickness towards the edge of the hole. The disclosure further relates to a method for production of such a packaging material, and uses thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.