Elevating platform toe space
US11014795B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB66F11/044
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A toe space module for elevating platforms, wherein the module wraps around the edges and bottom of the platform in order to transform tension stress into shear and compression stresses. Also, a platform with a toe space module attached, and method for manufacturing the platform and toe space module. Also, a combination toe space module and step, a platform with the combination toe space module and step, and methods for manufacturing the platform with the combination toe space module and step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.