Resin composition and method for manufacturing thermally conductive material
US11015018B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Sep 28, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Sep 28, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.