Distributed sensor arrays for measuring one or more of pressure and temperature and related methods and assemblies
US11015435B2 · kind B2 · utility
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42References
20Claims
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Key dates
| Filing date | Dec 17, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Jul 19, 2039 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/017
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A downhole sensor includes a sensor housing with one or more of a pressure sensor or a temperature sensor. A cable segment having a conductor is coupled to the sensor housing. A spacer or retention element is coupled to or secured to at least a portion of the conductor at a location proximate an interface between the cable segment and the sensor housing. Downhole sensor arrays include such sensor housings. Methods relate to forming such sensor arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.