Thermal management system
US11015534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Apr 12, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A thermal management system includes a first heat source assembly including a first heat source exchanger, a first thermal fluid inlet line extending to the first heat source exchanger, and a first thermal fluid outlet line extending from the first heat source exchanger; a second heat source assembly including a second heat source exchanger, a second thermal fluid inlet line extending to the second heat source exchanger, and second a thermal fluid outlet line extending from the second heat source exchanger; a shared assembly including a thermal fluid line and a heat sink exchanger, the shared assembly defining an upstream junction in fluid communication with the first thermal fluid outlet line and second thermal fluid outlet line and a downstream junction in fluid communication with the first thermal fluid inlet line and second thermal fluid inlet line; and a controller configured to selectively fluidly connect the first heat source assembly or the second heat source assembly to the shared assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.