Thermal flow measuring device and method for its manufacture
US11015964B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2016 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F15/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal, flow measuring device comprising a sensor with a metal sensor housing, which has a hollow body for connecting to a plug-in apparatus and/or a tube or pipe wall, wherein the hollow body has a base area; wherein the sensor housing has at least first and second pin sleeves, which protrude starting from the base area, wherein the metal sensor housing is embodied as one piece and the pin sleeves and the hollow body are connected together seam freely, especially weld seam freely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.