Apparatus and method of testing a wiring circuit
US11016143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2019 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Jun 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/308
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.