Systems and methods for providing heat-rejecting media on a cable assembly
US11016252B2 · kind B2 · utility
2Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2019 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Sep 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An active device module may include an active device, a housing configured to house the active device, and heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system, at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.