Heat dissipation apparatus and terminal device having same
US11016546B2 · kind B2 · utility
2Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Dec 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.