Method for securing a bonding product in a working region of a bonder

US11017554B2 · kind B2 · utility

Assignee

• Hesse GmbH · US

Inventors

• Hans-Juergen Hesse · Paderborn, DE
• Gregor Belting · Paderborn, DE
• Markus Riese · Worbis, DE

Key dates

• Filing date: Aug 2, 2019
• Grant date: May 25, 2021
• Expiry date: Nov 8, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/75901
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for securing a bonding product in a working region of a bonder via a clamping device. The bonding product and the clamping device are positioned in the working region of the bonder and a partial characteristic contour is captured to determine the position of the bonding product in the working region. The previously set clamping position of the clamping fingers is captured via a camera and a clamping position is calculated. A current position and orientation of clamping fingers and a new misalignment of the clamping fingers is calculated and displayed until the current position and orientation of the clamping fingers corresponds to a clamping finger reference position.