Collimator, fabrication apparatus including the same, and method of fabricating a semiconductor device using the same
US11017989B2 · kind B2 · utility
0Cited by
7References
10Claims
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Assignee
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Key dates
| Filing date | Sep 11, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Aug 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/231
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a collimator, a fabrication apparatus including the same, and a method of fabricating a semiconductor device using the same. The fabrication apparatus may include a chamber, a heater chuck provided in a lower region of the chamber and configured to heat a substrate, a target provided over the heater chuck, the target containing a source for a thin layer to be deposited on the substrate, a plasma electrode provided in an upper region of the chamber and configured to generate plasma near the target and thereby to produce particles from the source, and a collimator provided between the heater chuck and the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.